2013年11月27日 星期三

Flash筆記 Manual


  • STM32F407

  • 這塊板子是NAND Flash或是NOR Flash?
    • 板子詳細資料STM32F4
    • STM32F407VGT6解析
      • Device family:STM32 = ARM-based 32-bit microcontroller
      • Product type:F = general-purpose
      • Device subfamily:407= STM32F40x, connectivity, camera interface, Ethernet
      • Pin count:V = 100 pins
      • Flash memory size:G = 1024 Kbytes of Flash memory
      • Package:T = LQFP
      • Temperature range:6 = Industrial temperature range, –40 to 85 °C.
  • P.19
  • Core: ARM 32-bit Cortex™-M4 CPU with FPU,Adaptive real-time accelerator (ART
    Accelerator™) allowing 0-wait state execution from Flash memory, frequency up to 168 MHz,memory protection unit, 210 DMIPS/ 1.25 DMIPS/MHz (Dhrystone 2.1), and DSP instructions
  • Memories
    – Up to 1 Mbyte of Flash memory
    – Up to 192+4 Kbytes of SRAM including 64-Kbyte of CCM (core coupled memory)  data RAM
    – Flexible static memory controller supporting Compact Flash, SRAM,
    PSRAM, NOR and NAND memories
  • The STM32F405xx and STM32F407xx family incorporates high-speed embedded
    memories (Flash memory up to 1 Mbyte, up to 192 Kbytes of SRAM), up to 4 Kbytes of backup SRAM, and an extensive range of enhanced I/Os and peripherals connected to two APB buses, three AHB buses and a 32-bit multi-AHB bus matrix.
  • FSMC memory controller:YES
    • For the LQFP100 and WLCSP90 packages, only FSMC Bank1 or Bank2 are available. Bank1 can only support a multiplexed NOR/PSRAM memory using the NE1 Chip Select. Bank2 can only support a 16- or 8-bit NAND Flash memory using the NCE2 Chip Select. The interrupt line cannot be used since Port G is not available in this package.
  • AHB:AMBA High-performance Bus, internal bus for microcontrollers
  •  FSMC介紹:P.22
  • Boot modes:
    • At startup, boot pins are used to select one out of three boot options:
      • Boot from user Flash
      • Boot from system memory
      • Boot from embedded SRAM
    • The boot loader is located in system memory. It is used to reprogram the Flash memory by using USART1 (PA9/PA10), USART3 (PC10/PC11 or PB10/PB11), CAN2 (PB5/PB13), USB OTG FS in Device mode (PA11/PA12) through DFU (device firmware upgrade).
  • STM32F40x memory map(P.69)
    • Flash:0x0800 0000 - 0x080F FFFF
  • Flash interface register(p.71)
  • Maximum Flash memory access frequency with no wait state(p.79)

  •  
  • 關於fHCLK和fPCLK的計算和描述,可以看Manual Reference in P.82
  • Differences between ART accelerator enabled and disabled
  • Flash mode versus IDD_STOP:P.88
  • P.93
  • Flash memory characteristics:P.104
  • Flash Memory Programming:P105.106
  • Switching characteristics for NAND Flash read cycles:P.154.155
  • data latency 

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